发明名称 |
Underfill sealants with improved adhesion, improved resistance to moisture absorption and improved resistance to stress cracking |
摘要 |
This invention relates to thermosetting resin compositions useful as underfill sealants for mounting to a circuit board semiconductor device packages, which have a semiconductor chip on a carrier substrate. Reaction products of these compositions demonstrate improved adhesion after exposure to elevated temperature conditions, improved resistance to moisture absorption and improved resistance to stress cracking.
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申请公布号 |
US2002058756(A1) |
申请公布日期 |
2002.05.16 |
申请号 |
US20010988257 |
申请日期 |
2001.11.19 |
申请人 |
LOCTITE CORPORATION |
发明人 |
KONARSKI MARK M. |
分类号 |
C08F8/32;C08G59/50;C08G59/68;H01L21/56;H01L23/29;H05K3/30;(IPC1-7):C08F8/00 |
主分类号 |
C08F8/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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