Method for temperature monitoring during unsoldering of components from a circuit board in which the melting temperature is determined using simple mechanical and electrical means

摘要

Method in which the component (10) to be removed is tensioned with a mechanical lifting device (11) and heat applied to the solder. As soon as the solder reaches melting point, the component is lifted away by the tensioned lifting device. When a movement of the component is detected, an electrical signal is derived that has a fixed relation to the melting temperature. The temperature of the solder can be immediately measured and used for calibration of conventional solder measurement mechanisms. After a pre-set time delay, heat supply to the solder can be turned off. The invention also relates to a device for removal of soldered components and monitoring the solder temperature.