发明名称 APPARATUS AND METHOD FOR MEASUREMENT OF FILM THICKNESS
摘要 PURPOSE: To provide a method and an apparatus wherein the film thickness of a conductive thin film formed on a substrate can be measured with satisfactory efficiency and at low costs, by a method wherein the relative distance between an eddy-current coil sensor and the conductive thin film is kept always at a constant value, and the change amount of an inductance in the eddy-current coil sensor is measured always under the same condition. CONSTITUTION: The film-thickness measuring apparatus is provided with the eddy-current coil sensor 20 which is constituted so as to be capable of being arranged in a prescribed position near the conductive thin film 51, which generates a prescribed eddy current with reference to the film 51, and which detects a magnetic field due to the eddy current; and a laser displacement sensor 30 which is used to measure the displacement between the coil sensor 20 and the film 51. The measuring apparatus is constituted in such a way that the thickness of the film 51 is measured on the basis of the change amount of the inductance in the coil sensor 20 and on the basis of a displacement amount measured by the sensor 30.
申请公布号 KR20020035786(A) 申请公布日期 2002.05.15
申请号 KR20010069243 申请日期 2001.11.07
申请人 ULVAC, INC. 发明人 CHEN KAI;MINAMITSU AKIHITO;NAKAMURA SHIZUO
分类号 G01B7/00;G01B7/06;G01B11/00;G01B21/08;(IPC1-7):G01B7/02 主分类号 G01B7/00
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