发明名称 |
BONDED STRUCTURE AND ELECTRONIC CIRCUIT BOARD |
摘要 |
<p>A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material. <IMAGE></p> |
申请公布号 |
EP1206170(A1) |
申请公布日期 |
2002.05.15 |
申请号 |
EP20010912339 |
申请日期 |
2001.03.14 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SUETSUGU, KENICHIRO;KOSHI, MASUO;TODOROKI, KENICHIRO;HIBINO, SHUNJI;TAKANO, HIROAKI;NAKATA, MIKIYA;MAEDA, YUKIO |
分类号 |
H05K1/00;H05K1/11;H05K3/34;H05K3/40;(IPC1-7):H05K1/18 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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