| 摘要 |
The three-dimensional circuit body of the present invention is obtained by the steps of forming an insulating layer formed on the three-dimensional, that is, corrugated car body frame, discharging conductive paste along the surface of the insulating layer and curing the conductive paste simultaneously with discharging operation to form the circuit patterns. The circuit pattern is formed by moving the discharging unit and curing unit along the insulating layer formed on the surface of the car body frame, while discharging the conductive paste from the discharging unit onto the insulating layer and curing the same simultaneously with discharging operation, thereby simplifying the manufacturing process of the three dimensional circuit body and reducing consumption of material. |
