Avoidance of cross-sectional surface reduction in wide soft metal wires
摘要
A method of manufacturing semiconductor circuits or electronic packages is provided. The step of splitting up wide metal areas into metal stripes is included into the physical design step of such devices. This method does not increase the data complexity significantly and guarantees correctness of the design. Furthermore, the method allows to solve the dishing problem that is inherent to copper wiring technologies. <IMAGE>
申请公布号
EP0982774(A3)
申请公布日期
2002.05.15
申请号
EP19990112135
申请日期
1999.06.24
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
ENGLISH, GEORGE;KEINERT, JOACHIM;RETTIG, OLIVER, DR.