发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining method and laser beam machine capable of machining a hole which is uniform and has excellent quality. SOLUTION: A CCD camera 11 and a light source 17 for a CCD camera are arranged above a X-Y table 9. Furthermore, an acrylic plate 13 in addition to a printed board 8, a work is placed on the X-Y table 9. At the predetermined period, the acrylic plate 13 is irradiated with output of laser light 2a which is used in actual machining, and an image of a machined hole is picked up by the CCD camera 11. Provided observed data is compared with an allowable value which is previously inputted to a NC device, and when the observed data is close to the limit of the allowable value, machining is conducted correcting machining conditions so that the observed data comes in the center side of the allowable value.</p>
申请公布号 JP2002137074(A) 申请公布日期 2002.05.14
申请号 JP20000333405 申请日期 2000.10.31
申请人 HITACHI VIA MECHANICS LTD 发明人 FUTAANA MASARU;MURAKAMI TETSUO
分类号 B23K26/00;B23K26/02;B23K26/03;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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