发明名称 POLYAMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide composition with less thermal discoloration even exposed for many hours under high temperature while maintaining characteristics of polyamide. SOLUTION: This polyamide composition comprises, as the antioxidant, 0.01 to 3 pts.wt. of a hindered phenolic antioxidant (D), 0.01 to 3 pts.wt. of a pentavalent phosphorus antioxidant (E), and 0.01 to 3 pts.wt. of a trivalent phosphorus antioxidant each to 100 pts.wt. of a composition comprising 40 to 100 wt.% of a polyamide resin (A), 0 to 60 wt.% of a polyolefin resin (B), and 0 to 60 wt.% of an inorganic filler (C).
申请公布号 JP2002138194(A) 申请公布日期 2002.05.14
申请号 JP20000336218 申请日期 2000.11.02
申请人 TOYOBO CO LTD 发明人 EGUCHI HIDEKI;TAKEUCHI MANABU;TAMURA TSUTOMU
分类号 C08L77/00;C08K3/00;C08K5/13;C08K5/5313;C08L23/00;(IPC1-7):C08L77/00;C08K5/531 主分类号 C08L77/00
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