Dual cure, low-solvent silicone pressure sensitive adhesives

摘要

A pressure sensitive adhesive composition includes an alkenyl-terminated polydiorganosiloxane, a silanol-terminated polydiorganosiloxane, a resinous copolymer, an organohydrogenpolysiloxane with terminal Si-H groups, a hydrosilation catalyst, and an organic cross-linking agent. The composition provides excellent high temperature adhesion properties and enables coatable formulations with low solvent content.