POLYIMIDE FILM, METHOD OF PRODUCING THE SAME AND METAL CIRCUIT BOARD HAVING THE SAME AS SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a polyimide film with excellent film formability, having high elasticity, low coefficient of thermal expansion and alkali etching performance when applied to the substrate of a metal circuit board such as a flexible print circuit(FPC), a chip size package(CSP), a ball grid array(BGA) or a tape automated bonding(TAB) on the surface of which a metal circuit is made, and to provide a metal circuit board using the film as a substrate. SOLUTION: This polyimide film is obtained from a polyamic acid synthesized by the reaction of pyromellitic acid dianhydride with 10 to 60 mol% of phenylenediamine and 40 to 90 mol% of 3,4'-oxydianiline both based on total diamines.