| 摘要 |
To accommodate the operational and structural requirements of high performance integrated circuits, an integrated circuit package includes conductive trenches that are formed within a substrate. The trenches provide increased current carrying capacity, lower inductance, higher capacitance, and single and/or dual reference planes for signal conductors. Trench structures can be provided at various locations within the substrate, such as adjacent to signal conductors and embedded capacitors, as well as on the substrate periphery to couple the package to a socket. Trenches can be formed by routing, drilling, imprinting, and/or microperforation. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
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