| 摘要 |
In order to obtain a semiconductor device of which bonding reliability between a semiconductor element 7 and a printed wiring board 1 is improved and a manufacturing method thereof, in a semiconductor device mounted a semiconductor element 7 on a printed wiring board 1, while a circumference of a metal bump 3 formed on a conductor pad electrode disposed on the printed wiring board in wiring pattern and an electrode 6 disposed along an external periphery of a semiconductor element 7 facing the metal bump 3 is provided with, along a placement position of the metal bump 3 or the electrode 6, frame- or wall-shaped anisotropic conductive film 4, a gap between the semiconductor element 7 and the printed wiring board 1, the insides of the anisotropic conductive film 4 formed in frame or wall shape, is filled by sealing material such as epoxy resin or the like.
|
