摘要 |
A pick-up apparatus for picking up semiconductor chips comprising an integrated or a separately rotatable composite cam formed by a plurality of cylindrical cams, and a plurality of cylindrical pin holders having a plurality of push-up pins, and at least part of the pin holder is in contact with the composite cam. The rotation of the composite cam selects one of the pin holders suited for pushing up a desired semiconductor chip, and the counter rotation selects another pin holder suited for another semiconductor chip having a different size. In this manner, a plurality of semiconductor chips having different sizes can be properly picked up without replacing the pin holder.
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