发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device to enable the high efficient use of an abrasive tape and prevention of reduction of polishing capacity. SOLUTION: The polishing device comprises a polishing head body 3 on which the abrasive tape T is mounted; a support member 1 to support the polishing head body 3; and a polishing table 2 on which a material to be polished is mounted. As the abrasive tape T is brought into contact with the material to be polished placed on an installation surface 24 of the polishing table 2, the polishing head body 3 is rotated based on a support member 1 around a line, serving as an axis Z, orthogonal to the installation surface 24 of the polishing table 2. In the so formed polishing device, the abrasive tape T is mounted on the polishing head body 3 such that the contact part of the abrasive tape T brought into contact with the material to be polished installed on the polishing table 2 is positioned further radially externally than a rotary axis Z of the polishing head body 3.
申请公布号 JP2002137158(A) 申请公布日期 2002.05.14
申请号 JP20000330865 申请日期 2000.10.30
申请人 I M T KK 发明人 MORIKAWA KANAME;NAKADA HIROSHI;YUGAMI MASANORI
分类号 B24B21/12;(IPC1-7):B24B21/12 主分类号 B24B21/12
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