发明名称 Triple metal line 1T/1C ferroelectric memory device and method for fabrication thereof
摘要 Disclosed is a triple metal line 1T/1C ferroelectric memory device and a method to make the same. A ferroelectric capacitor is connected to the transistor through a buried contact plug. An oxidation barrier layer lies between the contact plug and the lower electrode of the capacitor. A diffusion barrier layer covers the ferroelectric capacitor to prevent diffusion of material into or out of capacitor. As a result of forming the oxidation barrier layer, the contact plug is not exposed to the ambient oxygen atmosphere thereby providing a reliable ohmic contact between the contact plug and the lower electrode. Also, the memory device provides a triple interconnection structure made of metal, which improves device operation characteristics.
申请公布号 US6388281(B1) 申请公布日期 2002.05.14
申请号 US20000617912 申请日期 2000.07.17
申请人 SAMSUNG ELECTRONICS CO. LTD. 发明人 JUNG DONG-JIN;KIM KI-NAM
分类号 H01L27/105;H01L21/02;H01L21/316;H01L21/8246;H01L27/10;H01L27/115;(IPC1-7):H01L29/76;H01L27/108 主分类号 H01L27/105
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