发明名称 Electroless silver plating
摘要 This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances that may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.
申请公布号 US6387542(B1) 申请公布日期 2002.05.14
申请号 US20000611185 申请日期 2000.07.06
申请人 HONEYWELL INTERNATIONAL INC. 发明人 KOZLOV ALEXANDER S.;PALANISAMY THIRUMALAI;NARASIMHAN DAVE
分类号 C23C18/44;(IPC1-7):B05D1/18;B05D5/12;C09D5/00 主分类号 C23C18/44
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