发明名称 METHOD OF BONDING AND BONDED BODY BONDED BY THE METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of bonding which can control generation of a crack or breakage and allow using an organic solvent with high temperature, and a bonded body of high reliability bonded by using the method. SOLUTION: The method is characterized in that glass paste containing glass powder is provided between at least two ceramics to be bonded, and irradiated with microwave to melt the glass powder to bond them.
申请公布号 JP2002137972(A) 申请公布日期 2002.05.14
申请号 JP20000329628 申请日期 2000.10.27
申请人 KYOCERA CORP 发明人 NISHIZONO KAZUHIRO
分类号 C04B37/00;(IPC1-7):C04B37/00 主分类号 C04B37/00
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