| 摘要 |
A method of attaching a first part to a mating part. The method comprises depositing a bondable film layer over a surface of a first part and a solderable pad on the surface. The method further comprises creating an opening in the film layer around the solderable pad to expose the solderable pad, positioning a mating part near the first part so that a solderable pad on the mating part is adjacent a solder ball on the first part, and bonding the film layer to the mating part.
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