STENCIL TYPE PLATE PROCESSING APPARATUS AND METHOD FOR PLATE PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a stencil type plate processing apparatus by which pinholes are prevented from being generated in a finely porous sheet and a plate with suppressed heat shrinkage can be obtained and a method for plate processing. SOLUTION: Ratio of the size of a heating element to the pitch of the heating element in the main scanning direction of a thermal head is made at least the lower limit value where heating temperature distribution where there exists no possibility of generating pinholes is obtained and at most the upper limit value where heating temperature distribution where accuracy of dimension of the finely porous plastic sheet can be held is obtained and ratio of the size of the heating element to the pitch of the heating element in the sub-scanning direction of the thermal head is made at least the lower limit value where heating temperature distribution where there exists no possibility of generating pinholes is obtained and at most the upper limit value where heating temperature distribution where the accuracy of dimension of the finely porous plastic sheet can be held is obtained.