Method and system for plastic package decapsulation of electronic devices

摘要

Aspects for a decapsulation system and technique are described. In a method aspect, a portable decapsulation system is provided beneath at least one integrated circuit device on a printed circuit board. Package decapsulation of the least one integrated circuit device occurs through acid blasting by the portable decapsulation system. The portable decapsulation system includes a beaker, fuming acid within the beaker, and a sealed fitting for the beaker and holding an electronic device being decapsulated. Capillaries within the sealed fitting through which the fuming acid is released acid blast the electronic device, and a waste tube coupled to the sealed fitting for removal of solid waste during the acid blast.