WAFER CLEANING APPARATUS AND LOW FLOW RATE ULTRASONIC NOZZLE USED IN SUCH APPARATUS

摘要

PURPOSE: A wafer cleaning apparatus is provided to minimize a defect in a cleaning process by effectively preventing a vibrating device from being damaged by an air layer even if the air layer is formed in a nozzle and an interfacial condition is formed between the vibrating device and cleaning solution. CONSTITUTION: An ultrasonic nozzle(2) applies ultrasonic waves to the cleaning solution supplied through a water path, and the vibrating device(4) is installed inside the ultrasonic nozzle. An oscillating unit(6) supplies current to the vibrating device and induces ultrasonic waves. A control unit(8) detects the current supplied from the oscillating unit to the vibrating device, and intercepts the current when the detected current is more than a predetermined value. A display unit(10) displays various kinds of information, electrically connected to the control unit.