| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for fabricating a semiconductor device, by which a metal electrode portion is efficiently formed. SOLUTION: An opening 5 which exposes a pad portion 3 is formed in a passivation film 4 on the surface of a semiconductor substrate 1. The metal electrode portion 8 is disposed in the opening 5 by delivering a metal paste from an ink jet nozzle 10 after a bimetal film 6 is placed. |
