SEMICONDUCTOR INTEGRATED CIRCUIT CHIP, BOARD AND THEIR MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit chip which has fine electrode pads, a semiconductor integrated circuit board in order to manufacture the fine integrated circuit chip, and manufacturing methods of the semiconductor integrated circuit chip and the semiconductor integrated circuit board. SOLUTION: A metallic column 25 consisting of conductive materials is vertically formed on an electrode pad 14 which is an I/O terminal of an integrated circuit chip 10.