发明名称 METHOD AND EQUIPMENT FOR HEAT TREATMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat treatment equipment wherein the surface of a plate-like object is parallel to a heating plate or cooling plate positioned above for every heating or cooling process. SOLUTION: The gas is made to flow between a fixed part 7a and a movable part 7b constituting a spherical bearing 7, and a support plate 8 supporting a lift pin 9 is allowed to tilt. Under this condition, the lift pin 9 is raised by a motor 4 with no plate-like object W supported, so that the upper end of the lift pin 9 pressurizes the lower surface of a cooling plate 2. The movable part 7b is fixed to the fixed part 7a by sucking, and the lift pin 9 is lowered together with the support member 8 as it is. Then the plate-like object W is placed on the lift pin 9, and the lift pin 9 is raised again so that the surface of plate-like object W approaches the cooling plate 2 for cooling process.</p>
申请公布号 JP2002134592(A) 申请公布日期 2002.05.10
申请号 JP20000319210 申请日期 2000.10.19
申请人 TOKYO OHKA KOGYO CO LTD;TATSUMO KK 发明人 AOKI TAIICHIRO;NAKAMURA AKIHIKO;SATO YASUYUKI;IMAI TOSHINORI;NISHIE AKITOMO
分类号 H01L21/683;H01L21/00;H01L21/027;H01L21/324;(IPC1-7):H01L21/68 主分类号 H01L21/683
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