发明名称 |
LASER DIODE MODULE AND MOUNTING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized laser diode module which can efficiently radiate heat from a laser diode and consumes small power. SOLUTION: The external surface 15 of a bottom plate 2 of a package 7 is formed as a mounting surface of a printed board 20, a base 6 is fixed to the inner wall face 9 side of an upper plate 8 of the package 7, and the laser diode 3 is fixed to the base 6. A heat radiation means 4 is provided on the external surface 16 side of the upper plate 8 of the package 7. The heat radiation means 4 comprises a plurality of radiation fins 5 disposed at regular intervals. Heat can be efficiently radiated by radiating heat from the laser diode 3 through the base 6, upper plate 8, and heat radiation means 4.
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申请公布号 |
JP2002134825(A) |
申请公布日期 |
2002.05.10 |
申请号 |
JP20000321377 |
申请日期 |
2000.10.20 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
KATO TOMOYA;SHIMIZU TAKEO;IWASE MASAYUKI;MURATA HIDEAKI |
分类号 |
G02B6/42;H01S5/022;H01S5/024;(IPC1-7):H01S5/024 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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