| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser module which can improve the heat exchange efficiency between a thermoelectric module and a semiconductor laser over the conventional one. SOLUTION: The laser module comprises the thermoelectric module 11, semiconductor laser 19 formed on a first substrate, and housing 25 for packaging the thermoelectric module. The thermoelectric module 11 comprises a plurality of thermoelements 12a and 12b, and the first substrate and a second substrate between which the thermoelements are interposed. Out of the first and the second substrate, at least the first substrate is formed of silicon.
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