| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the short-circuit accident of a pin for the microwave signal of an MIC module during manufacture while holding the stability of the ground face of a high frequency signal in the panel attaching structure of the MIC module. SOLUTION: A conductive adhesion sheet is arranged between the MIC module and a panel when the MIC module is attached to a metal panel to adhere and fix both the ground faces. Circular through holes of the center of cutting dies 21, 22 are size in which a pin for transmitting the high frequency signal of the MIC module is not in contact with the conductive adhesion sheet 2. Pressure is applied between the MIC module and the panel for adhesion, and the conductive adhesion sheet 2 needs to be extended so as not to be in contact with the pin during the pressurization. Therefore, the cutting dies 21, 22 are radially arranged so that a cut part is not overlapped on a plurality of the partially cut concentric cutting dies around the circular hole.
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