| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal base circuit board, which can prevent trouble which is generated by suppressing generation of burrs on a metal plate and the generation of film residue in the metal plate, when the circuit board is punched in the latter process when manufacturing the circuit board. SOLUTION: The manufacturing method of a metal base circuit board pastes a polyester film 4 on the surface of the circuit board constituted by forming a conductor circuit 3 on a metal plate 1 via an insulating layer 2 to punch the circuit board by a press metal mold. The thickness of the film 4 is preferably 0.01 to 0.06 mm and moreover, and the adhesive strength of the film 4 is preferably 200 to 1500 N/25 mm.
|
