| 摘要 |
PROBLEM TO BE SOLVED: To provide a board for a semiconductor package and its manufacturing method superior in the adhesion of a radiation slug and the board, resin sealing of a chip mounting cavity part, and reliability and productivity of a heat cycle. SOLUTION: One face of the radiation slug 101 of a copper plate is roughed, a photo-curing photosensitive insulation resin film 102 is molded thereon, and after curing is performed except for a cavity part 2 by ultraviolet ray exposure, the cavity part 2 is removed. The surface is copper-plated 103 to form a resist 104, inner and outer connection terminals and a wiring part are left to form a circuit pattern 105 by etching. A solder resist 106 insulating and coating a wiring conductor is formed, Ni/Au electroless plating 7 is performed, and a solder ball 10 is applied to complete a semiconductor package board. The semiconductor chip is mounted on the cavity part, connected to the connection terminal and the chip is sealed by a resin to make the semiconductor package.
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