| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device testing apparatus which can implement a burn-in test by surely bringing probe needles into contact with all the testing terminals even if a wafer diameter is large, for example, 12 inches (300 cm). SOLUTION: For a first board 3 and a second board 4 having beams provided with a plurality of projecting probe terminals, the same material with a semiconductor wafer, namely silicon wafer is sued. Herewith, since the thermal expansion coefficient of both materials is the same, even if the temperature goes up during the burn-in test, it does not occur that the terminals of the integrated circuit under test and the terminals of the probe are out of alignment insomuch as to make contact failures.
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