发明名称 |
SUBSTRATE PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To sufficiently enhance quality in treatment of a substrate, and also to shorten the time required for the treatment. SOLUTION: A square-rectifying plate 4 is adopted, where slits 4a are formed so that they extend in a direction orthogonal to a first treatment liquid supply pipe 2 and a second treatment liquid supply pipe 3 and also the slit pitch is set to prescribed pitch (preferably, a pitch equal to the pitch of a substrate which is the object of treatment).
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申请公布号 |
JP2002134467(A) |
申请公布日期 |
2002.05.10 |
申请号 |
JP20000327480 |
申请日期 |
2000.10.26 |
申请人 |
DAIKIN IND LTD;TOHO KASEI KK |
发明人 |
MAEDA TOKUO;KI KANNAN;ONO MASAO;MATSUMOTO TAKAO |
分类号 |
B08B3/04;H01L21/304;H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
B08B3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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