发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To sufficiently enhance quality in treatment of a substrate, and also to shorten the time required for the treatment. SOLUTION: A square-rectifying plate 4 is adopted, where slits 4a are formed so that they extend in a direction orthogonal to a first treatment liquid supply pipe 2 and a second treatment liquid supply pipe 3 and also the slit pitch is set to prescribed pitch (preferably, a pitch equal to the pitch of a substrate which is the object of treatment).
申请公布号 JP2002134467(A) 申请公布日期 2002.05.10
申请号 JP20000327480 申请日期 2000.10.26
申请人 DAIKIN IND LTD;TOHO KASEI KK 发明人 MAEDA TOKUO;KI KANNAN;ONO MASAO;MATSUMOTO TAKAO
分类号 B08B3/04;H01L21/304;H01L21/306;(IPC1-7):H01L21/306 主分类号 B08B3/04
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