发明名称 METHOD FOR FORMING SEMICONDUCTOR THIN FILM
摘要 PROBLEM TO BE SOLVED: To make silicon epitaxially grow in stabilized state by crystallizing an amorphous silicon thin film over a large area. SOLUTION: An amorphous silicon film 2 is formed on a quartz substrate 1, an SiO2 film 3 is formed partially on the amorphous silicon film 2, and a catalytic element is added to a specified region 4 of the amorphous silicon film 2, where the SiO2 film 3 is not formed. Subsequently, the specified region 4 added with the catalytic element and the specified region of the amorphous silicon film 2 added with no catalytic element and formed with the SiO2 film 3 are subjected to high-temperature annealing. Furthermore, the method includes adding the catalytic element to the specified region 4 and to subject the specified region 4 added with catalytic element and the specified region which is not added with the catalytic elements to high-temperature annealing.
申请公布号 JP2002134406(A) 申请公布日期 2002.05.10
申请号 JP20000320095 申请日期 2000.10.19
申请人 SHARP CORP 发明人 NAKAMURA YOSHINOBU;MAEKAWA SHINJI;UMENAKA YASUYUKI
分类号 H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L21/20
代理机构 代理人
主权项
地址