| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing apparatus which can manufacturing a semiconductor device accurately. SOLUTION: This apparatus comprises a rack 35, a frame 65 provided in a standing condition on the rack 35, a mounting head 20 provided on the frame 65 so as to move freely in a horizontal positioning as well as free up and down movement and bonds a TAB device 19 with a printed board 30 by being driven downward in the opposed position to a predetermined mounting area on a board, a CCD camera 32 attached on the frame 65 so as to recognize a mounting position by taking photos of the printed board 30, a support pillar 68 provided in a standing condition on the rack 35 in non contact with the frame, and an up-and-down driving mechanism 70 supported by the support pillar 68, driving the mounting head 20 downward by pressing the top of the mounting head 20 in the opposed position to a predetermined mounting area.
|
