发明名称 COMPRESSION MOLD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a conductive compression-mold with no conductive powder added. SOLUTION: A compression-mold 1 is provided in which small cylindrical base materials 2 are dispersed in a binder. The surface of the small cylindrical base material is conductive and oriented in one direction. The small cylindrical base material is provided by cutting or crushing, and further contracted into a curl, a vapor-deposited magnetic tape in which a magnetic layer is formed on a non-magnetic support body. Waste magnetic tapes are for the vapor- deposited magnetic tape.
申请公布号 JP2002134983(A) 申请公布日期 2002.05.10
申请号 JP20000327643 申请日期 2000.10.26
申请人 SONY CORP 发明人 HOSOYA TAKESHI;IWASAKI KAZUHARU
分类号 H01F1/00;H01F41/02;H05K9/00 主分类号 H01F1/00
代理机构 代理人
主权项
地址