发明名称 |
COMPRESSION MOLD AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive compression-mold with no conductive powder added. SOLUTION: A compression-mold 1 is provided in which small cylindrical base materials 2 are dispersed in a binder. The surface of the small cylindrical base material is conductive and oriented in one direction. The small cylindrical base material is provided by cutting or crushing, and further contracted into a curl, a vapor-deposited magnetic tape in which a magnetic layer is formed on a non-magnetic support body. Waste magnetic tapes are for the vapor- deposited magnetic tape. |
申请公布号 |
JP2002134983(A) |
申请公布日期 |
2002.05.10 |
申请号 |
JP20000327643 |
申请日期 |
2000.10.26 |
申请人 |
SONY CORP |
发明人 |
HOSOYA TAKESHI;IWASAKI KAZUHARU |
分类号 |
H01F1/00;H01F41/02;H05K9/00 |
主分类号 |
H01F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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