| 摘要 |
PROBLEM TO BE SOLVED: To suppress bad influence to an environment by simplifying a process, reducing a cost and thinning a device. SOLUTION: The surface of a part corresponding to the chip mounting area of a glass board 11 is activated by plasma processing in vacuum, a side forming the electrode of a thin film-like silicon chip 12 and the face 12a of the contrary side are adhered to the activated surface A, and a required shape wiring pattern 15 is formed so as to connect a conductor 14 exposed from the glass board 11 to the electrode of the silicon chip 12. |
