| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board wherein alignment precision of a mask film is superior in all layers, a fine circuit can be formed with high position precision and waste of material can be excluded, when a multilayer printed wiring board is manufactured by using a build-up method. SOLUTION: In this method for manufacturing a multilayer printed wiring board, a build-up method is used. Blind through holes 2 are formed by irradiating an insulating layer 3 with at least two shots of a laser beam L1. By irradiating the insulating layer 3 with the laser beam L1 wherein the number of shots is smaller than the number necessary for forming the through holes 2, markers 1 for exposure which have a height from a surface of the insulating layer 3 to a position which does not reach the surface of inner layer material 4 are formed.</p> |
