| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board wherein cracks are not generated in a resin filler layer and peeling is not generated between the resin filler layer and an interlayer resin insulating layer or the like under heat cycle condition, and connection reliability is superior. SOLUTION: In this multilayer printed wiring board, conductor circuits 34 and interlayer resin insulating layers 50 are laminated in order on both surfaces of a substrate 30, and a part between the conductor circuits which sandwich the substrate and the interlayer resin insulating layers is connected via through holes 35. In the through hole, the resin filler layer wherein resin filler containing epoxy resin, hardener and inorganic particles is cured is formed. The content of the inorganic particles in the resin filler layer is 10-50 wt.%. |
