摘要 |
PROBLEM TO BE SOLVED: To provide a switching power supply which can reduce the influence of the heat radiating from the frame of an electronic component, arranged near the frame or a side plate of a case, and the case. SOLUTION: The metallic frame 1 or case is used as a heat radiating member. Notches 16 and 17 of large size are provided at positions of the frame 1 or the side plate 1c of the case near the electronic components 9A and 11A of relatively large size. The notches 16 and 17 are lower in temperature than the frame 1, so the quantity of heat radiation and convection to the electronic components 16 and 17 are reduced to suppress temperature rise of the electronic components 9A and 11A.
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