PACKAGE FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a package for a semiconductor device that it is easy to manufacture and that has a high reliability, where a lead is sealed into an eyelet by means of resin. SOLUTION: This package for a semiconductor device where the lead 12 inserted into an inserting hole is electrically insulated from the eyelet 10 by the resin 30 and sealed into the eyelet 10 that is formed in the shape of a cap by pressing a metal plate and that is provided with the hole to insert the lead into, is characterized in that a locking means such as a locking groove 28 to prevent the resin 30 from being drown from the eyelet 10 is provided in a surface adhering to the resin 30 of the eyelet 10.