OUTPUT STAGE ESD PROTECTION FOR INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a new ESD protection technology for a circuit connected to an output stage. SOLUTION: An integrated circuit including a transistor comprises a first electrode connected to an output bonding pad and a second electrode connected to a reference potential such as a grounded bonding pad. A degeneration device is connected between the second electrode and the reference potential. A diode is connected between the second electrode of a transistor and the reference potential, an anode of the diode is connected to the second electrode reference potential and a cathode of the diode is connected to the reference potential for a PNP transistor.