发明名称 METHOD AND APPARATUS FOR CONTROLLING A MOLD MELT-FLOW PROCESS USING TEMPERATURE SENSORS
摘要 <p>A method and apparatus controlling a mold melt flow using inner (impinge) and/or edge temperature sensors (316, 310, 312, 314). Thermal waveforms from thermal sensor array data such that if a sequence of melt temperature set-point trigger times fluctuates outside control limits, then the melt-flow is judged as a hotter/faster or cooler/slower melt-flow injection process. An initial melt temperature set-point 'trigger' and second reference set-point 'trigger' are combined to control the closure of at least one cavity gate in accordance with an injection melt-flow time and temperature profile. The nozzle orifice (310) area sets an initial melt-flow rate. Each mold cavity (318) final melt-flow 'pack' volume is preferably contolled by a gate cavity melt shut-off system that is responsive to the sensed temperature(s), resulting in each cavity melt-flow injection process volume being held substantially constant, for a uniform resin 'shrink' density.</p>
申请公布号 WO2002036326(A1) 申请公布日期 2002.05.10
申请号 US2001046619 申请日期 2001.11.05
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址