TANTALUM OR TUNGSTEN TARGET-COPPER ALLOY BACKING PLATE ASSEMBLY AND PRODUCTION METHOD THEREFOR

摘要

A tantalum or tungsten target-copper alloy backing plate assembly which comprises a tantalum or tungsten target and a copper alloy backing plate that are diffusion-joined via an aluminium- or aluminium alloy-sheet insert material at least 0.5 mm thick, and which is provided with diffusion-joint interfaces between the respective materials, wherein the assembly suffers only a small deformation after diffusion-joining and is free from separation between the target and the backing plate or from cracking even when the target materiel and the backing plate differ greatly in thermal expansion coefficient, and can survive high-power sputtering; and a production method therefor.