发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 A semiconductor device comprises a semiconductor substrate (101) of the first conductivity type, a source layer (102) of the second conductivity type formed over the surface in the semiconductor substrate (101), a drain layer (103) of the second conductivity type facing the source layer (102) with a predetermined interval from the source layer (102), a gate insulation film (104) formed over the semiconductor substrate (101), a gate layer (105) formed over the gate insulation film (104) between the source layer (102) and the drain layer (103), a source electrode (108) formed over the semiconductor substrate (101) and electrically connected to the drain layer (103), a drain electrode (109) formed over the semiconductor substrate (101) and electrically connected to the drain layer (103), a gate electrode (107) formed over the semiconductor substrate (101) and electrically connected to the gate layer (105), and a capacity adjusting electrode (114) formed over the gate insulation film (104).
申请公布号 WO0237573(A1) 申请公布日期 2002.05.10
申请号 WO2001JP09342 申请日期 2001.10.24
申请人 KABUSHIKI KAISHA TOSHIBA;KIKUCHI, KOUJI 发明人 KIKUCHI, KOUJI
分类号 H01L27/04;H01L21/822;H01L29/10;H01L29/417;H01L29/423;H01L29/78;(IPC1-7):H01L29/78;H01L21/336;H01L21/823;H01L27/088;H01L27/06 主分类号 H01L27/04
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