发明名称 FIELD INSPECTION DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a field inspection device which can properly monitor thermal abnormality of an object to be monitored by photographing a visible image whose position relation with a thermal image is already known simultaneously with the thermal image. SOLUTION: The position relation between a digital camera 2 and an infrared camera 3 is fixed by a fixing jig 8 and the object 1 to be monitored is photographed; and a shape recognizing device 12 recognizes the shape of the object 1 by processing the visible image 9 and identifies the position of a component of the object 1 in an infrared image according to the previously found relation between the field angles of the thermal image and visible image. An abnormality monitor device 15 makes a comparison with past temperature distribution data on the identified component to detect abnormality of the object.</p>
申请公布号 JP2002132341(A) 申请公布日期 2002.05.10
申请号 JP20000326661 申请日期 2000.10.26
申请人 TOSHIBA CORP 发明人 CHIHOSHI ATSUSHI;AIKAWA TETSUO;ITOU YOSHINO
分类号 G01B11/24;G01D21/00;G01J5/48;G05B23/02;(IPC1-7):G05B23/02 主分类号 G01B11/24
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