POLISHING METHOD AND POLISHING TOOL

摘要

PROBLEM TO BE SOLVED: To provide a polishing method which effectively lessens defects (scratches) on a polishing surface for various works, thereby realizing high- quality polishing. SOLUTION: The method of polishing a semiconductor wafer W pressed to and slid along a polishing surface comprises a first polish step of planarizing a surface of the wafer W and a second polishing step of finish-polishing the wafer surface with feeding an abrasives liquid Q, containing elastic grains 3 to the polishing surface at the start or the midway of the polishing process.