| 摘要 |
PROBLEM TO BE SOLVED: To provide connection material, a connection structure and a method for manufacturing the same materializing connection or the like between layers of high integration density, high productivity and very low connection resistance. SOLUTION: A copper foil 1 (main conductor layer) has a nickel plating layer 3 on the whole surface of one side and a thicker patterned nickel plating layer 2 on the surface of the opposite side, and has a gild plating layer 4 on a surface of the nickel plating layer 2 and a copper plating layer 5 (base layer conductor layer) on the surface of the nickel plating layer 3. The copper foil 1 is etched with the gold plating layer 4 and the nickel plating layer 2 as a mask, to form a scattered protrusion body 10, and the nickel plating layer 3 is etched with a mask of the protrusion body 10. Consequently, connection material, having most of electrical conduction path of connection part composed of a solid metal (copper foil 1 or the like), is obtained. By pressing the connection material on an object to be connected, the connection structure is obtained.
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