| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating method which prevents contamination with cut chip or growth of burr during dicing of a substrate and efficiently executes post-processes, such as cleaning, drying, etc., as the chips make an array, after dicing. SOLUTION: The treating method comprises laminating protective layers 4, 5 with adhesives 6a, 6b on the surface of a substrate 1 having metal pattern layers 3a, 3b, dicing the substrate 1 down to at least the protective layers into dies, mounting the substrate 1 with the laminated projective layers on a tray 9 with a base plate 9a having protrusions 9b on the upside, with the protrusions 9b loosely fitted into trenches 8 cut by dicing the substrate 1 and dipping the substrate 1 in a releasing liquid 11 to dissolve the adhesives 6a, 6b, thereby separating the protective layers 4, 5 from the substrate 1. |
