| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning treatment device and a cleaning treatment method which can reduce a cleaning treatment time of a treated substrate with a large area and can improve the throughput. SOLUTION: A scrub cleaning unit (SCR) 21a, which subjects a substrate, such as a semiconductor wafer W, etc., to a prescribed cleaning treatment, has a spin chuck 71 which holds the wafer W approximately horizontally and turns it within a single plane, brushes 76a and 76b which clean the upper surface of the wafer W held by the spin chuck 71, brush-holding arms 77a and 77b which hold the brushes 76a and 76b respectively, and arm drive mechanisms 79a and 79b, which scan the surface of the wafer W by moving the brush-holding arms 77a and 77b, so as to make the brushes 76a and 76b cross the upper surface of the wafer W independently. It is so structured that the brush holding arm 77b can overtake the brush holding arm 77a in the scanning direction.
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