| 摘要 |
PROBLEM TO BE SOLVED: To provide an ozone treating apparatus for improving temperature distribution in the inside of the surface of a wafer of a material to be treated. SOLUTION: The ozone treating apparatus comprises a means for supplying a process gas containing the ozone to a reaction chamber 7, a first stage shower plate 10 provided at a passage for supplying the process gas to the wafer 1 placed in the chamber 7, and a second stage shower plate 22. It is preferred to provide two to four stages of the shower plates. |
