发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR ITS PREPARATION, AND SEMICONDUCTOR DEVICES |
摘要 |
A positive photosensitive resin composition having high sensitivity is provided which can form patterns with high resolution and high film thickness retention and can give by curing film excellent in mechanical characteristics, adhesion, and water absorption. This composition comprises 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitive diazoquinone compound (B) and a filler (C), the content (F) of the filler (C) as defined by the following formula ranging from 2 to 70 wt %. F = filler (C) / (alkali-soluble resin + filler (C)) |
申请公布号 |
WO0237184(A1) |
申请公布日期 |
2002.05.10 |
申请号 |
WO2001JP08858 |
申请日期 |
2001.10.09 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED;HIRANO, TAKASHI;OKAAKI, SHUSAKU |
发明人 |
HIRANO, TAKASHI;OKAAKI, SHUSAKU |
分类号 |
G03F7/004;G03F7/022;G03F7/023;(IPC1-7):G03F7/022;G03F7/037;H01L21/027 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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